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3D Microelectronic Packaging: From Architectures to Applications
$16.89
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- Comprehensive guide to 3D microelectronic packaging technologies, from design to applications
- Covers a wide range of topics, including materials, processes, and characterization techniques
- Provides in-depth analysis of 3D packaging architectures and their impact on device performance
- Explores the latest applications of 3D packaging in various industries, including consumer electronics, automotive, and medical
- Features contributions from leading experts in the field
- Includes numerous illustrations and tables to aid understanding
- Written in a clear and concise style, making it accessible to a wide audience
- Essential reading for anyone involved in the design, fabrication, or application of 3D microelectronic packages
Condition: New original from publisher
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