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Semiconductor Packaging: Materials, Processes, and Reliability (Springer Series in Advanced Manufacturing)
$16.90
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- Comprehensive guide to advanced semiconductor packaging technologies
- Covers materials, processes, and design for high-performance and high-density packaging
- Includes chapters on 3D packaging, fan-out wafer-level packaging, and embedded passives
- Written by leading experts in the field
- Provides practical insights and case studies
- Essential reading for engineers and researchers working in semiconductor packaging
- Up-to-date coverage of the latest trends and developments
- In-depth analysis of key challenges and solutions
Condition: New original from publisher
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